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Packaging - Overview

Fujifilm Electronic Materials packaging CMP slurries are designed to polish advanced packaging materials to enable heterogenous integration and 3D packaging.

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Overview
Applications
  • Multiple platforms with different baseline material removal selectivities
  • Excellent selectivity and tunable selectivity
  • Compatibility with metals & corrosion free

Product Lineup

  • PSL2000C
    • Designed packaging applications that require removal of epoxy mold compound
    • Flexible platform can accommodate a wide variety of filler loadings and types
    • Compatible with copper, tin, and gold metals
  • PSL2100C
    • Designed for polyimide packaging applications
    • High purity colloidal silica facilitates easy handling and low scratching
    • Compatible with copper and tin with tunable metal removal rates
  • PSL2200C
    • Designed for BSPDN bulk silicon polish,  also for Polysilicon, SiGe, Amorphous silicon CMP
    • High silicon removal rates, consistent over pad life
    • No pad staining, improved defectivity
    • Highly dilutable
  • PSL2300C
    • Designed for advanced packaging application, specifically Cu hybrid bonding polish
    • High barrier metal and ILD removal rates with adjustable rate and selectivity
    • Low defectivity and smooth surface finish
    • Offers tunable Cu recess control
    • Minimizes ILD rounding and topo loading
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