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- Outstanding corrosion protection for sensitive copper features and very low defectivity
- Suitability for a wide range of integration schemes including low-K and ULK dielectrics, etch hard masks, and ARC layers
- Fast removal of conventional barrier films and Co liner film
- Independent component knobs for film selectivity tuning and customization, resulting in excellent final topography correction and surface finish
- Attractive cost of ownership – Concentrated formulations available to provide lower cost at point-of-use
Market-leading products are available to meet a broad range process and technology requirements.
Available Copper Barrier CMP Slurries
- BSL8180C
- A Cobalt compatible alkaline barrier slurry designed for a wide variety of integration schemes that utilize low-K dielectrics
- Wide range of tune-ability of Copper and low-k/ULK removal rates
- High purity colloidal silica
- Ultra-low defectivity
- Excellent performance on soft pads
- Concentrated formulation for low cost of ownership
- BSL8400C
- A higher concentrated version, designed for the most advanced low-K dielectric integrations
- Wide range of tune-ability of Copper and low-k/ULK removal rates
- High purity colloidal silica
- Ultra-low defectivity
- Excellent performance on soft pads
- Concentrated formulation for low cost of ownership
- BSL8250C
- A cost competitive colloidal silica slurry suitable for both hard and soft pads
- Very high barrier and dielectric removal rates with Tunable Cu rate suitable for a range of applications including logic, memory and thick TEOS containing devices
- BSL8300C
- Designed for Ru liner polishing
- High purity silica formulation in alkaline pH
- High Ru removal rate
- Tunable Cu and low K rates
- Dilutable formulation with cost competitiveness
