- Abrasive free buff chemistries on platen buff application
- Excellent particles, trace metal and organic residue removal
- Compatibility with existing slurries
- Outstanding corrosion protection for sensitive metals
Product Lineup
- MCN3200C
- Buff / Pad cleaner for W and dielectric material application
- Better organic residue and particle cleanability
- Better cleanability for Tiny Particle in advance node process
- MCN5900C
- Abrasive-free on-platen buff cleaner tailored for advanced node cobalt applications
- Effectively reduces defects generated during polishing, such as silica particles, organic residues, metal contaminants
- Provides excellent cobalt protection with no risk of corrosion
- Highly dilutable formulation for attractive cost of ownership
- BCN8100C
- On-platen buff cleaner designed for advanced node liner applications to reduce defectivity
- Enhances cleaning efficiency for tiny silica particles
- Effectively removes metal (Cu, Co, Ru) contaminations including metal ions, oxides and byproducts
- Abrasive-free formulation with optional H₂O₂ addition
- Highly dilutable formulation for attractive cost of ownership
- BCN8200C
- H₂O₂ -free on-platen buff cleaner and post-CMP cleaner (2-in-1) designed for advanced node BEOL applications to reduce defectivity
- Provides excellent Cu/Co protection with no risk of corrosion
- Effectively removes metal (Cu, Co, Ru) contaminations including metal ions, oxides and organic residue
- Enhances cleaning efficiency for tiny silica particles
- Highly dilutable formulation for attractive cost of ownership
