UV curable resist for nanoimprint lithography (NIL) that contributes to cost reduction and power saving in advanced semiconductor manufacturing.
Adhesion agent for NIL that provides adhesion between substrate and resist to prevent loss of circuit patterns transferred onto the resist when the mask is peeled off at high speed.
What is NIL?
This technology transfers and forms a circuit pattern by pressing a mask (mold) with an engraved circuit pattern onto a resist on a wafer used in semiconductor manufacturing, like a stamp. Unlike photolithography, which is conventionally used in semiconductor manufacturing, there is no developing or rinsing process, and complex optical systems for exposure are not required.
- High resolution mask patterns are faithfully transferred. Complex patterns (3D structures, etc.) can be formed in one shot.
- No need for complex optics in the exposure system, simple manufacturing process (no need for developing or rinsing processes), power-saving and low-cost process.
Example of NIL component configurations in semiconductor manufacturing
Product Lineup
- NIL resist for advanced semiconductor applications
- NIL adhesion material
Features ＆ Benefits
- UV curing
- Non-PFAS
- Dry etching resistance
- Excellent mask release properties
