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FUJIFILM Electronic Materials Front End CMP slurries are designed for devices that utilize advanced transistor technologies such as high-K metal gates, advanced dielectrics, 3-dimensional FinFET transistors, and self-aligned contacts. Various product platforms are available to meet a broad range of process and technology requirements.
FUJIFILM Electronic Materials advanced Front End CMP slurries are designed for use in the critical early stages of device fabrication, removing materials in in a controlled manner to provide the ideal surface for subsequent steps in the production flow.
Copper CMP Slurries
FUJIFILM Electronic Materials copper CMP slurries are designed to remove the copper overfill to expose underlying damascene interconnects.
Barrier CMP Slurries
FUJIFILM Electronic Materials barrier CMP slurries are designed to remove the barrier metals that are exposed following the copper clearing step as well as to planarize all films across the wafer surface.
Emerging Metal Slurries
FUJIFILM Electronic Materials Cobalt CMP slurries are designed to polish cobalt and barrier metals and planarize all films in the circuits during advanced Cobalt interconnect polish.
Post CMP Cleaners
FUJIFILM Electronic Materials Post CMP slurries are designed to clean particles, trace metal and organic residues while protecting the metal surface.
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