United States

Polyimides and PBO's

Materials for stress relief buffer coat or redistribution layer

Polyimide and Polybenzoxazole (PBO) products are specialty stress relief coatings used as a protective layer or "buffer coat" before packaging or redistribution layer (RDL).

Buffer coat layers provide protection to finished die during back grind, singulation and assembly processing resulting in improved packaged yields and increased reliability lifetime performance. Redistribution layer applications enable the most advanced packaging designs.

silicon wafer
Photosensitive - Aqueous Developable

PBO based products designed and optimized for buffer coat and RDL

Macro Silicon Wafer
Photosensitive - Solvent Developable

Designed for thick film capability, robust processing and with excellent mechanical properties

Polyimides PBOs non-photosensitive
Non-Photosensitive

Materials for low shrinkage, low temperature and lift off applications

Rainbow Pattern
Ancillaries

Edge bead removers, backside rinse and optimized developers for optimal processing