- Wide process latitude
- Compatible with spray and batch tool applications
- Compelling cost of ownership advantage over hydroxylamine (HA) solvent-based cleaners - Direct DI water rinse
- Eliminates IPA rinsing chemical cost
- Increased throughput by eliminating IPA-rinse steps
- Safe and easy to use
- Excellent process equipment materials compatibility
- Superior metals and ILD compatibility
- Packaging options:
- 4 L HDPE bottle
- 200 L drum
United States
Semiconductor Materials
Cleaners - Features & Benefits
Aqueous post ash residue cleaners on aluminum and copper alloys, anti-reflective layers, SiO2 and low-k dielectrics
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Wet chemistries to strip or etch photoresist & other materials
