Applications include post etch clean at via, metal line, and bond pad levels on Al alloys, anti-reflective layers, and SiO2 dielectrics, and etch residue removal for advanced MOL and BEOL processes with Cu, low-k and ultra-low-k compatibility.
Cleaning/Drying - Applications
Aqueous post etch cleaners compatible with aluminum, copper, and advanced metal alloys, anti-reflective layers, SiO2 and ultra low-k dielectrics
