![Manufacturing Chain](https://asset.fujifilm.com/www/sg/files/2020-02/bee880d5ff3457ece6f01ec7cd7d4377/cleaners-applications.png)
- Removing etch residues at via, metal line, and bond pad levels on Al alloys, anti-reflective layers, and SiO2 dielectrics.
- Etch residue removal in damascene processes with Cu, low-k and ultra low-k compatibility.
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Aqueous post ash residue cleaners on aluminum and copper alloys, anti-reflective layers, SiO2 and low-k dielectrics