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Polyimides and PBO's

Materials for stress relief buffer coat or redistribution layer

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Polyimide and Polybenzoxazole (PBO) products are specialty stress relief coatings used as a protective layer or "buffer coat" before packaging or redistribution layer (RDL).

Buffer coat layers provide protection to finished die during back grind, singulation and assembly processing resulting in improved packaged yields and increased reliability lifetime performance. Redistribution layer applications enable the most advanced packaging designs.

Product Lineup

silicon wafer

Photosensitive - Aqueous Developable

PBO based products designed and optimized for buffer coat and RDL
Macro Silicon Wafer

Photosensitive - Solvent Developable

Designed for thick film capability, robust processing and with excellent mechanical properties
Polyimides PBOs non-photosensitive

Non-Photosensitive

Materials for low shrinkage, low temperature and lift off applications
Blue Molecules

Ancillaries

Additional ancillary chemicals for use with our polyimide and PBO products
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