Emerging Metal Slurries - Overview

• Outstanding corrosion protection for sensitive cobalt features
• Compatibility with a wide range of integration schemes including varies dielectrics, etch hard masks, and ARC layers
• Tunable selectivity to meet customized film stacking and final finishing targets
• Attractive cost of ownership – concentrated formulations available to provide lower cost at point-of-use

Market-leading products are available to meet a broad range of process and technology requirements.

• MSL5100C
  • Step 1 Cobalt slurry platform for removal of damascene Co metal features
  • Highly concentrated for low cost of ownership
  • Proprietary corrosion inhibitor system provides excellent corrosion protection of Cobalt metal
  • Good planarization efficiency
  • Tunable selectivity to Ti and TiN
• MSL5200C
  • Step 2 Cobalt slurry platform for final polish of damascene Co metal and dielectric features
  • Concentrated formulation for attractive cost of ownership
  • Tunable Co removal rate, independent of other films
  • Excellent surface finish with excellent Cobalt metal protection

• MSL5500C
  • Ruthenium (Ru) slurry platform for removal of Ru metal features
  • Concentrated formulation for attractive cost of ownership
  • Proprietary corrosion inhibitor system provides excellent corrosion protection of Mo metal
  • Good planarization efficiency
  • High selectivity to dielectric films

• MSL5600C
  • Molybdenum (Mo) slurry platform for removal of damascene Mo metal features
  • Concentrated formulation for attractive cost of ownership
  • Proprietary corrosion inhibitor system provides excellent corrosion protection of Ru metal
  • Good planarization efficiency
  • High selectivity to dielectric films

• MSL3100C
  • Tungsten (W) slurry with either stop on dielectrics or non-selective to dielectrics
  • Good stop on silicon nitride, oxide, SiGe and polysilicon films for stop on dielectric applications
  • Tunable rates and selectivities of W and silicon-based dielectrics for non-selective applications
  • High purity colloidal silica based highly dilutable formulations for ultra-low defectivity
• MSL3200C
  • Tungsten (W) slurry platform for final polish of W metal and dielectric features
  • Concentrated formulation for attractive cost of ownership
  • Tunable W removal rate, independent of other films
  • Excellent surface finish with excellent W metal protection

Contact Us for more information and a complete product overview