Etchants - Overview

We offer a broad range of diluted Hydrofluoric (HF) ratios, specialty Buffered Oxide Etchants (BOE) - with/without surfactant, Mixed Acid etchants (MAE) & specialty metal etchants

• Buffered Oxide Etchants 
  • Fujifilm has advanced capabilities for the precise blending of Buffered Etchants with tight assay specification ranges, available in multiple NH4F:HF ratios 
  • Utilized to etch SiO2 films 
  • Utilized as pre-diffusion and pre-metallization surface preparations
  • Formulated from high purity 49% Hydrofluoric Acid and high purity 40% Ammonium Fluoride
  • Available with and without surfactant
• Dilute HF 
  • Fujifilm has advanced capabilities for the precise blending of dilute HF with tight assay specification ranges 
• Freckle Etch 
  • For the removal of residual silicon nodules left after etching aluminum-silicon-copper layers
• Mixed Acid Etchants 
  • For the isotropic etching of silicon (mono and poly-crystalline)
• Specialty Pad Etchants 
  • Used to etch deposited pyro lytic and sputtered final passivation glasses in order to expose semiconductor bonding pads for wire bonding
  • Available with and without our OHS surfactant

• Specialty Metal Etchants

For the selective removal of specific metal layers Fujifilm offers various specialty etchants, including 

• Specialty Aluminum Etchants: Immersion etchants for aluminum metallization layers - Available with or without the Fujifilm Aluminum Etch Surfactant (AES)