Fujifilm to Present Latest Advanced Lithography Research at SPIE Advanced Lithography + Patterning 2025 Conference

TOKYO, February 20, 2025 – FUJIFILM Corporation today announced that two representatives from its Electronic Materials Research & Development Center, Keiyu Ou and Akihiro Hakamata, will present two papers on their latest research on advanced lithography technologies (specifically EUV^*1 Resist and EUV Developer as well as Nanoimprint Resist), at the SPIE Advanced Lithography + Patterning 2025 Conference (SPIE 2025). SPIE 2025 is a world-renowned international conference where leaders of the semiconductor industry, researchers and engineers gather to share the latest advancements and technological innovations related to semiconductor lithography technologies. The event will take place February 23-27, 2025, in San Jose, California.

Fujifilm was the first in the world to develop and commercialize the NTI^*2 process, which has helped to pave the way in the miniaturization of semiconductor circuits using ArF lithography^*3. By providing negative-tone EUV resist and EUV developer compatible with the evolved NTI process for EUV, Fujifilm optimizes the circuit pattern formation process. By utilizing the functional molecule technology cultivated through its development of conventional photoresists, Fujifilm’s process maintains a uniform acid concentration within the resist film during EUV exposure, which enables reduced fluctuation in circuit patterns, by approximately 17%^*4.

In her presentation, Fujifilm’s Keiyu Ou will showcase her research on “solvent developer type negative EUV resist” technology, which was developed as an alternative to the currently mainstream “alkali developer type positive EUV resist.” The research suggests that by using the newly developed EUV developer solution, it is possible to achieve high resolution of circuit patterns, which will be presented in Fujifilm’s future roadmap for EUV CAR-NTD^*5. It also introduces various patterning examples that support pillar patterns and hole patterns as well as line patterns. In addition, at “SPIE 2025”, research results that support the practical application of EUV CAR-NTI are scheduled to be announced by other companies, and the potential for development of this technology is expected.

To view the research abstract, visit: https://spie.org/advanced-lithography/presentation/Exploring-stochastic-reduction-and-lithographic-performance-by-using-EUV-CAR/13428-18 

Fujifilm’s nanoimprint resist can fill the complex circuit patterns engraved on the mask to ensure the transfer and formation of nanometer-level circuit patterns. Further, after curing with UV irradiation, the resist exhibits mold release properties that prevent defects in the circuit patterns transferred to the resist even when the mask is peeled off at high speed. This enables improvements in throughput (patterning processing capacity per hour) and yield due to low defects, which were issues in the practical application of nanoimprint lithography (NIL)^*6 , and contributes to cost reduction in advanced semiconductor manufacturing.

Akihiro Hakamata will present his research on semiconductor device manufacturing using NIL, in which the company has successfully developed nanoimprint resists by designing and synthesizing functional materials such as monomers, adhesives, and release agents that can be applied to various processes such as resist coating, resist filling, and release using inkjet printing. In this presentation, Hakamata will introduce the material technology developed to achieve the features of Fujifilm’s nanoimprint resists, as well as the adhesion agent developed specifically for this purpose.

To view the research abstract, visit: https://spie.org/advanced-lithography/presentation/Development-of-UV-NIL-resist-for-semiconductor-device-manufacturing/13427-18

“SPIE is the premier event for semiconductor lithography technology,” said Tetsuya Iwasaki, Director, Corporate Vice President, FUJIFILM Corporation and General Manager of Electronic Materials Business Div. “As a key supplier of materials for two cutting-edge semiconductor technology fields, EUV and nanoimprint lithography, we are looking forward to presenting our research on these key topics at SPIE in order to help further the critical field of lithography.”

For more information about FUJIFILM Electronic Materials, visit: https://www.fujifilm.com/em-global/en.

• *1 Advanced lithography technology using extreme ultraviolet (EUV) light, necessary for generations with features finer than 10 nanometers.
• *2 Negative Tone Imaging (NTI) process. A negative development process in which the unexposed areas are removed by the developer after exposure to create the circuit pattern.
• *3 An exposure method using ArF (argon fluoride) excimer laser light with a wavelength of 193 nanometers, currently the most widely adopted advanced lithography technology.
• *4 Fujifilm reduced Line Width Roughness (LWR), an indicator of circuit pattern variability, by approximately 17% compared to when PCP is not used.
• *5 Negative-tone development (NTD) technology for chemically amplified resists (CAR).
• *6 A new manufacturing technology that enables the low-cost, low-power production of high-performance cutting-edge semiconductors. This technology transfers and forms circuit patterns by pressing a mask (mold) with the circuit pattern engraved on it against the resist on the wafer used in semiconductor manufacturing, like a stamp. Unlike photolithography, which is widely used in semiconductor manufacturing, this technology does not require a development process or a rinse process, and it also does not require the complex optical system used for exposure.

FUJIFILM Electronic Materials offers semiconductor materials used in wafer processing to post processing in semiconductor manufacturing including photoresists^*7, photolithography-related materials^*8, CMP slurries^*9, post-CMP cleaners^*10, thin-film chemicals^*11, polyimides^*12 and high-purity process chemicals^*13, as well as WAVE CONTROL MOSAIC^™*14 which includes color filter materials for image sensors. In addition to its extensive product lineup covering almost the entire range of semiconductor manufacturing processes, from leading-edge to legacy semiconductors, the company is committed to solving customers' issues and contribute to the development of the semiconductor industry by providing one-stop solutions that leverage its global supply structure and advanced R&D capabilities. For more information, please visit: https://www.fujifilm.com/em-global/en.

• *7 Material used to coat wafer substrate when circuit patterns are drawn in the process of semiconductor manufacturing.
• *8 Development solutions, cleaners and other materials used in the photolithography process of semiconductor manufacturing.
• *9 a proprietary formulation containing an abrasive that uniformly planarizes semiconductor surface, which contains a mixture of wires and insulation films of varying hardness.
• *10 Cleaners used after polishing with CMP slurry to remove particles, minute metal fragments and organic residues while protecting the metal surface.
• *11 Materials for forming low-dielectric insulation films.
• *12 A material with strong heat resistance and insulation properties, used for forming semiconductors’ protective films and rewiring layer.
• *13 High-purity chemicals used in the cleaning and drying processes. The chemicals are employed to remove contaminants during the cleaning and drying stages of semiconductor manufacturing, as well as to eliminate metals and oils during the etching process.
• *14 General term referring to a group of functional materials for controlling electromagnetic light waves in a broad range of wavelengths, including photosensitive color materials for manufacturing color filters for image sensors such as CMOS sensors, used in digital cameras and smartphones. WAVE CONTROL MOSAIC is a registered trademark or trademark of FUJIFILM Corporation.

FUJIFILM Holdings Corporation, headquartered in Tokyo, leverages its depth of knowledge and proprietary core technologies to deliver innovative products and services across the globe through the four key business segments of healthcare, electronics, business innovation, and imaging with over 70,000 employees. Guided and united by our Group Purpose of “giving our world more smiles,” we address social challenges and create a positive impact on society through our products, services, and business operations. Under its medium-term management plan, VISION2030, which ends in FY2030, we aspire to continue our evolution into a company that creates value and smiles for various stakeholders as a collection of global leading businesses and achieve a global revenue of 4 trillion yen (29 billion USD at an exchange rate of 140 JPY/USD). For more information, please visit: www.fujifilmholdings.com.

For further details about our commitment to sustainability and Fujifilm’s Sustainable Value Plan 2030, click here.

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