Fujifilm Participates in “SEMICON Japan 2024”, an International Exhibition of Semiconductor Manufacturing Equipment and Materials in Japan

TOKYO, November 29, 2024 – FUJIFILM Corporation will participate in “SEMICON Japan 2024”, an international exhibition of semiconductor manufacturing equipment and materials, to be held at Tokyo Big Sight from December 11 to 13, 2024.

Fujifilm offers semiconductor materials used in wafer processing to post processing in semiconductor manufacturing including photoresists^*1, photolithography-related materials^*2, CMP slurries^*3, post-CMP cleaners^*4, thin-film chemicals^*5, polyimides^*6 and high-purity process chemicals^*7, as well as WAVE CONTROL MOSAIC^™*8 which includes color filter materials for image sensors. In addition to its extensive product lineup covering almost the entire range of semiconductor manufacturing processes, from leading-edge to legacy semiconductors, Fujifilm is committed to solving customers' issues and contribute to the development of the semiconductor industry by providing one-stop solutions that leverage its global supply structure and advanced R&D capabilities.
Furthermore, Fujifilm provides functional materials for semiconductor manufacturing, including microfilters designed for removing particles, as well as pressure measurement films used to visualize pressure information such as the flatness of wafer bonding.

Fujifilm will accelerate the development and provision of semiconductor materials and functional materials that meet customer needs, contributing to the advancement of the semiconductor industry.

• * WAVE CONTROL MOSAIC is a registered trademark or trademark of FUJIFILM Corporation.

• *1 Material used to coat wafer substrate when circuit patterns are drawn in the process of semiconductor manufacturing
• *2 Development solutions, cleaners and other materials used in the photolithography process of semiconductor manufacturing
• *3 A polisher for evenly levelling semiconductor surface, which contains a mixture of wires and insulation films of varying hardness.
• *4 Cleaners used after polishing with CMP slurry to remove particles, minute metal fragments and organic residues while protecting the metal surface
• *5 Materials for forming low-dielectric insulation films
• *6 A material with strong heat resistance and insulation properties, used for forming semiconductors’ protective films and rewiring layer
• *7 High-purity chemicals used in the cleaning and drying processes. The chemicals are employed to remove contaminants during the cleaning and drying stages of semiconductor manufacturing, as well as to eliminate metals and oils during the etching process.
• *8 General term referring to a group of functional materials for controlling electromagnetic light waves in a broad range of wavelengths, including photosensitive color materials for manufacturing color filters for image sensors such as CMOS sensors, used in digital cameras and smartphones

• *9 A mobile app that can quantify items such as the maximum pressure (MPa) and the area under pressure (mm²) by capturing “Prescale” with a mobile device.

• * Please note that the contents including the product availability, specification, prices and contacts in this website are current as of the date of the press announcement and may be subject to change without prior notice.