- Removing etch residues at via, metal line, and bond pad levels on Al alloys, anti-reflective layers, and SiO2 dielectrics.
- Etch residue removal in damascene processes with Cu, low-k and ultra low-k compatibility.
Hungary
Cleaners
Aqueous post ash residue cleaners on aluminum and copper alloys, anti-reflective layers, SiO2 and low-k dielectrics
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Wet chemistries to strip or etch photoresist & other materials
