Fujifilm’s solvent developable polyimides are a family of photo-imageable polyimide precursors and preimidized formulations, covering both high and low cure temperatures for redistribution layer (RDL) and buffer coat applications.
Product Lineup
- LTC 9300 Series
- Low temperature cure polyimides are photo-imageable polyimide precursors which are sensitive both in g- and i-line. They can therefore be imaged on all exposure tools. LTC 9300 series polyimides are ideally suited for redistribution layer applications for advanced packaging.
- Durimide™ 8300 Series
- High temperature cure polyimides are photo-imageable polyimide precursors which are sensitive both in g- and i-line. They can therefore be imaged on all exposure tools. Durimide™ 8300 series polyimides are ideally suited for buffer coat application in high reliability packages.
Features & Benefits
- Negative tone, solvent developable polyimides
- Photo-imageable using g-line, i-line and BB exposure tools
- Low or high temperature cure options
- Fast photospeed for high throughput
- Excellent mechanical properties for high reliability
- NMP free offerings for both high and low temperature cure
- See Datasheets for more details
- * "Durimide™ " is a trademark of FUJIFILM CORPORATION, registered in the United States and other countries and regions.
