- Removing etch residues at via, metal line, and bond pad levels on Al alloys, anti-reflective layers, and SiO2 dielectrics.
- Etch residue removal in damascene processes with Cu, low-k and ultra low-k compatibility.
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Cleaning/Drying - Applications
Aqueous post etch cleaners compatible with aluminum, copper, and advanced metal alloys, anti-reflective layers, SiO2 and ultra low-k dielectrics
