Fujifilm Launches EUV Resist and EUV Developer

TOKYO, October 29, 2024 – FUJIFILM Corporation announced the sales of negative-tone resists and developer for EUV^*1 lithography used in advanced semiconductor manufacturing processes. 
Fujifilm was the first in the world to develop and commercialize the NTI process^*2, a widely adopted negative development process and has led the way in miniaturization of semiconductor circuits using ArF lithography^*3. By providing negative-tone EUV resist and EUV developer compatible with the evolved NTI process for EUV, Fujifilm optimizes the circuit pattern formation process and contributes to further miniaturization. 
In conjunction with the commencement of EUV resist and EUV developer sales, Fujifilm will enhance the production and quality evaluation functions for EUV resist and EUV developer at its two sites in Shizuoka, Japan and Pyeongtaek, South Korea.

Driven by high-speed, high-capacity communications through 5G/6G, the expansion of autonomous driving, and the spread of AI and the metaverse, demand for semiconductors is expected to increase and their performance is projected to advance as well. EUV lithography, which uses extremely short-wavelength light to draw fine circuit patterns on wafers, is garnering increasing attention as a technology that enables the miniaturization of semiconductor circuits essential for enhancing semiconductor performance. With the anticipated proliferation of manufacturing processes using EUV lithography, the market for EUV resist, which are essential materials in these processes, is projected to grow at an annual rate of approximately 20%^*4. Similarly, the market for EUV developer is also expected to expand. 
Fujifilm offers NTI developer^*5, which uses organic solvents to enable the formation of sharper and finer circuit patterns, not only for ArF lithography but also for EUV lithography. NTI developer achieves high patterning precision by using high-purity organic solvents instead of traditional alkaline developers, thus suppressing resist swelling during development. Fujifilm was the first company to develop the NTI process, which has become the industry standard, and has contributed to the miniaturization of circuit patterns. 
Fujifilm has started the sale of EUV resist for the manufacturing processes utilizing EUV lithography technology. Fujifilm have introduced a photo-decomposable quencher-connected photoacid generator (PCP)^*6 with a reaction control function for photoresists, utilizing the functional molecule technology cultivated through its development of conventional photoresists. By maintaining a uniform acid concentration within the resist film during EUV exposure, Fujifilm has successfully reduced the fluctuation in circuit patterns, a challenge of conventional chemically amplified resists, by approximately 17%^*7.
In addition, Fujifilm has also introduced new EUV developer. By refining the formulation of organic solvents, Fujifilm has evolved its unique NTI developer specifically for EUV applications. EUV developer minimizes the swelling of the resist during development to the utmost limit, contributing to further miniaturization of circuit patterns. 
In conjunction with the launch of EUV resist and EUV developer, Fujifilm will enhance the production and quality evaluation functions for EUV resist and EUV developer. At the Shizuoka site in Japan, Fujifilm strengthens the production and quality evaluation functions for EUV resist by introducing state-of-the-art production equipment and inspection devices. At Pyeongtaek site in Korea, Fujifilm enhances the production and quality evaluation functions for EUV resist and EUV developer. In addition to installing a cleanroom, Fujifilm also introduces state-of-the-art production equipment and inspection devices. The equipment to be introduced at both sites is scheduled to begin operations in October 2025.
Fujifilm offers semiconductor materials used in wafer processing to post processing in semiconductor manufacturing including photoresists^*8, photolithography-related materials^*9, CMP slurries^*10, post-CMP cleaners^*11, thin-film chemicals^*12, polyimides^*13 and high-purity process chemicals^*14, as well as WAVE CONTROL MOSAIC^™*15 which includes color filter materials for image sensors. In addition to its extensive product lineup covering almost the entire range of semiconductor manufacturing processes, from leading-edge to legacy semiconductors, Fujifilm is committed to solving customers' issues and contribute to the development of the semiconductor industry by providing one-stop solutions that leverage its global supply structure and advanced R&D capabilities.

• * WAVE CONTROL MOSAIC is a registered trademark or trademark of FUJIFILM Corporation.

• *1 Advanced lithography technology using extreme ultraviolet (EUV) light, necessary for generations with features finer than 10 nanometers.
• *2 Negative Tone Imaging (NTI) process. A negative development process in which the unexposed areas are removed by the developer after exposure to create the circuit pattern
• *3 An exposure method using ArF (argon fluoride) excimer laser light with a wavelength of 193 nanometers, currently the most widely adopted advanced lithography technology.
• *4 Fuji Chimera Research Institute, Inc., “2023 Current Status and Future Prospects of Advanced and Emerging Semiconductor-Related Markets.”
• *5 Negative Tone Imaging (NTI) developer. It is used in the negative development process where the unexposed areas are removed by the developer after exposure to create the circuit pattern.
• *6 PAG Connected PDQ (Photo Decomposable Quencher). A functional material in which a Photoacid Generator (PAG) is combined with a quencher to evenly disperse the PAG and quencher.
• *7 Fujifilm reduced Line Width Roughness (LWR), an indicator of circuit pattern variability, by approximately 17% compared to when PCP is not used.
• *8 Material used to coat wafer substrate when circuit patterns are drawn in the process of semiconductor manufacturing
• *9 Development solutions, cleaners and other materials used in the photolithography process of semiconductor manufacturing
• *10 A polisher for evenly levelling semiconductor surface, which contains a mixture of wires and insulation films of varying hardness.
• *11 Cleaners used after polishing with CMP slurry to remove particles, minute metal fragments and organic residues while protecting the metal surface
• *12 Materials for forming low-dielectric insulation films
• *13 A material with strong heat resistance and insulation properties, used for forming semiconductors’ protective films and rewiring layer
• *14 High-purity chemicals used in the cleaning and drying processes. The chemicals are employed to remove contaminants during the cleaning and drying stages of semiconductor manufacturing, as well as to eliminate metals and oils during the etching process.
• *15 General term referring to a group of functional materials for controlling electromagnetic light waves in a broad range of wavelengths, including photosensitive color materials for manufacturing color filters for image sensors such as CMOS sensors, used in digital cameras and smartphones

• * Please note that the contents including the product availability, specification, prices and contacts in this website are current as of the date of the press announcement and may be subject to change without prior notice.